We have more than 30 years experience in the industry. Other than the main business activities, we offer equipment & packaging solution for semiconductor, Chip on Board & SMT assembly industry.
Additionally, we also provide equipment sales, spare parts, upgrade service & technical support.
Key equipment resales includes Alphasem, ASM, Disco, K&S, Kaijo, Shinkawa, TSK Solution etc.
Our core strength is on the continuous improvement of equipment and process capability.
The team experience covers from Microwave, IC, MLP, PGA, LED, Discrete (Micro & Power) and Clip Bonding (SMA, SMB, SMC) Assembly.
Moreover, we have successfully assisted several multinational company in developing new package assembly development e.g. Processor, Power Mite, SMT Fuse & PGA.
Our regional business network extends to countries such as Taiwan, China, Singapore, Korea, Philippines, Vietnam, Hong Kong, Thailand etc.